JPH0749818Y2 - 線状光源 - Google Patents

線状光源

Info

Publication number
JPH0749818Y2
JPH0749818Y2 JP1986039236U JP3923686U JPH0749818Y2 JP H0749818 Y2 JPH0749818 Y2 JP H0749818Y2 JP 1986039236 U JP1986039236 U JP 1986039236U JP 3923686 U JP3923686 U JP 3923686U JP H0749818 Y2 JPH0749818 Y2 JP H0749818Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diodes
emitting diode
row
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986039236U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62151774U (en]
Inventor
正美 保本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1986039236U priority Critical patent/JPH0749818Y2/ja
Publication of JPS62151774U publication Critical patent/JPS62151774U/ja
Application granted granted Critical
Publication of JPH0749818Y2 publication Critical patent/JPH0749818Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Laser Beam Printer (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
JP1986039236U 1986-03-18 1986-03-18 線状光源 Expired - Lifetime JPH0749818Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986039236U JPH0749818Y2 (ja) 1986-03-18 1986-03-18 線状光源

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986039236U JPH0749818Y2 (ja) 1986-03-18 1986-03-18 線状光源

Publications (2)

Publication Number Publication Date
JPS62151774U JPS62151774U (en]) 1987-09-26
JPH0749818Y2 true JPH0749818Y2 (ja) 1995-11-13

Family

ID=30852223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986039236U Expired - Lifetime JPH0749818Y2 (ja) 1986-03-18 1986-03-18 線状光源

Country Status (1)

Country Link
JP (1) JPH0749818Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102141211A (zh) * 2010-01-29 2011-08-03 丰田合成株式会社 光源装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073886B2 (ja) * 1984-08-17 1995-01-18 沖電気工業株式会社 発光ダイオ−ドによる照明方式

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102141211A (zh) * 2010-01-29 2011-08-03 丰田合成株式会社 光源装置

Also Published As

Publication number Publication date
JPS62151774U (en]) 1987-09-26

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